Unisem (M) Berhad (UNISEM) is a semiconductor packaging and test services provider in Malaysia. Its semiconductor packaging and test facilities are located in Ipoh, Perak, Malaysia. The Company offers integrated suite of packaging and test services, such as wafer bumping, wafer probing, wafer grinding, as well as range of leadframe and substrate integrated circuits packaging, wafer level chipscale packaging and radio frequency, analog, digital and mixed-signal test services. Its services include design, assembly, test, failure analysis, and electrical and thermal characterization. Unisem also has factory locations in Crumlin, South Wales, the United Kingdom; Chengdu, Batam, Indonesia and Sunnyvale, California, the United States of America (USA). The Company's subsidiaries are Unisem II Sdn. Bhd., Unisem Advanced Technologies Sdn. Bhd., Unisem (Europe) Holdings Limited, Unisem Chengdu Co., Ltd., Unisem (Mauritius) Holdings Limited and Unisem International (Chengdu) Ltd.
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