Techbond Group printed a long white candle to close above the 21-day SMA line. With a rising RSI level, its uptrend momentum may continue above RM0.705 towards a target price of RM0.74, followed by RM0.785. Meanwhile, it may turn sideways if it dips back below the RM0.705 mark in the near term. In this case, the support level is anticipated at RM0.66 whereby traders may exit on a breach to avoid the risk of a further correction.

Trading Call: Buy on further rebound above RM0.705

Target: RM0.74, RM0.785 (time frame: 4-8 weeks)

Exit: RM0.66

Source: AmInvest Research - 18 Jun 2019