BFM Podcast
拜登签署芯片法掣肘中国 拨款五百亿美元刺激产能
11-Aug-22 16:28
短期内二度确诊冠病的美国总统拜登，在当地时间 8 月 10 日，签署了『2022 芯片与科技法案』，并祭出逾 500 亿美元补贴、及一系列投资税收抵免等优惠政策，以鼓励企业赴美设厂，推动美国半导体行业的产能和发展。其中条款更明文表态：受补助企业在十年内不得于中国设立新厂，违规者或须全额退还补贴款项。美方选边站队的要求，随即招致中方「坚决反对」，中国驻美大使更警告法案将对国际贸易与芯片行业造成一定的紊乱。
全球半导体供应链受冠病疫情冲击之余，更已不再是行业的「家事」；在地缘政治中，中美的科技角力已然将半导体产业拉上了船，如今让其不得不成为拉锯中的关键筹码。本期节目，透过认识『芯片法案』的内容，我们将深入探讨这项立法能否达到围堵中国的效果。在面临全球芯片短缺危机的节骨眼，各国大厂在新法出台后真的要从中美两大市场中择一吗？
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